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Soldering devices

Compact devices for small batch production of printed circuit boards

  • Soldering bath for lead free soldering of printed circuit boards (drag-solder method)
  • Strong construction, anodised aluminum housing, two bath sizes avialiable
  • Aluminum solder tray with stainless steel insert, small batch of solder required
  • 2000VA heater, bimetal thermal circuit breaker, short heating time
  • Soldering tray is thermally separated from housing


Fluxing- and Drying Device

... for preparing printed circuit boards before soldering

  • Foam fluxer with integrated air supply, adjustable foam head
  • 2000VA heating plate for pre-heating and drying the printed circuit boards
  • Anodised aluminum housing (WxDxH) 620x260x120mm, compatible to solder bathes
  • Flux and Solder Boggie with adjustable inner rails, max boards size 350x180mm


Accessories

Assembly- /Solder frame

Assembly frame for printed circuit boards and soldering frame for hand-soldering procedures.
Aluminum profil construction with adjsutable inner rails and bracket out of spring steel


Flux- and Solder Bogie

Flux- and Solder Bogie 1
for soldering bath 1, (PCB size 180x180 mm)
Part no.: 149221

Flux- and Solder Bogie 2
for soldering bath 2, (PCB size 350x180 mm)
Part no.: 149222

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Lead free tin

Soldering tin, lead free
1unit = 1kg, (Pellets)
Part no.: 412293

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Foam Flux

Foam Flux GSP-2533
Low-solid-content foam flux for fluxing- and dryling device
1 unit = 1 Liter (in PVC bottle with safety closure)
Part no.: 154085

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Thinner for Foam Flux

Thinner BX-V
for Foam Flux GSP2533
1 unit = 1 Liter (in PVC bottle with safety closure)
Part no.: 155086

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