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Reflow Oven T200C+ for lead free soldering

  • Compact desktop unit for lead free soldering of SMD components.
  • Heating through 6x 600W infrared rays and hot air convection, warm-up time 3 min, soldering time 3 min ±1 min.
  • Programmable temperature profiles, up to 40 segment temperature curves, temperature accuracy ±2°C
  • Single channel temperature measurement (optional multi channel sensors)
  • With purifying and filtering exhaust gas function
  • Loading drawer, maximum PCB dimension 360 x230mm
  • Dimension (WxDxH) 780 x 660 x 500mm, weight 55 kg
  • Power: 230V/50Hz, 3,8kW


Reflow Oven T200N+, lead free with nitrogen

  • Compact desktop device for lead free soldering of SMD components
  • Heating trough 6x600W infrared rays and hot air convection, heating time 3 min, soldering time 3 min, ±1 min.
  • Programmable temperature profiles, up to 40 segment temperature curves, Temperature accuracy ±2°C
  • Optimized airflow system enables steep temperature curves (shorting warm up time and cool down time)
  • Serial Interface (Rs232) for programming capture and managing the temperature profiles, software included in delivery.
  • Temperature sensor for monitoring temperature profiles for critical components
  • Purification of exhaust gas, integrated with activated-carbon filter
  • Loading drawer for PCB size up to 270x320mm
  • Dimension (WxDxH) 670x555x370mm, weight 42 kg
  • Power: 230V/50Hz, 3,8kW(peak)